Geçici yüzeylerde metal desenlendirme için DRIE tabanlı bir şablon maskesinin geliştirilmesi

Electronics with the potential to disappear or disintegrate into non-traceable remains after a stable performance have attracted significant interest. These categories of devices have been established based on the integration of conductive layers with polymeric substrates. Developing a compatible fabrication method is critical in the case of biodegradable substrates due to their delicate nature. However, lack of a simple and efficient microfabrication method in biodegradable device fabrication results in large sized, and low output in comparison with silicon-based devices. Stencil lithography (SL), which uses a perforated membrane as a reusable shadow mask to pattern metal on substrates offers a straightforward and flexible method for the fabrication of functional devices on a wide range of substrate materials. Here, a silicon-based stencil mask is fabricated by deep reactive ion etching (DRIE) technique using a 1:1 aspect ratio recipe to serve multiple purposes. The application of DRIE-based silicon stencil metal patterning is investigated by metal patterning (molybdenum and gold) on different substrates such as polylactic acid (PLA), polyglycerol sebacate (PGS), polyimide and polydimethylsiloxane (PDMS). PLA and PGS are widely used biodegradable materials with flexibility and stretchability features. The resistance levels of the resistor patterned on PLA and polyimide are 796.63 ± 0.14 Ω and 658 ± 0.03 Ω, respectively, which are very close to the theoretical calculations. Polyimide and PDMS are common nondegradable substrates with flexibility and stretchability properties, respectively. As another application, the silicon-based stencil mask application is demonstrated for etching the PLA substrate. The degradation behavior of the biodegradable samples is investigated in a phosphate-buffered saline (PBS) solution. The work presented here provides a facile and resist-free fabrication method using DRIE-based silicon stencil for metal patterning on the transient substrates.