Stress analysis of applied series double-pin connection and bonded in different metal plates
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Abstract (EN)
In this study, stress analysis of metal plates having various characteristics which glued with epoxy adhesive and applied double series pin were investigated. ANSYS finite element software was used for analysis, modeling and solving operations. Modeling was performed and considered as three dimensions. Various boundary conditions and loads were applied on the model. Following the tensile load appling to model, a different temperature loads were added to the tensile load in analysis. The obtained data were analyzed separately for each model and hole circles. The intensive stress concentration has been found in the hole region. Additionally, coefficients of thermal expansion between the materials, different stresses were occured.
Author
Emrullah Özkan
How to Cite
Emrullah Özkan (Master Thesis). Stress analysis of applied series double-pin connection and bonded in different metal plates, 2015, Aksaray University.
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