Sodium carboxymethylcellulose (Na-CMC) modified particleboard production

In this study, particleboards are produced with sodium carboxymethylcellulose (Na-CMC) modified urea formaldehyde glue (UF). The effect of the ratio of Na-CMC used in UF modification over the physical and mechanical properties of particleboards was analyzed. In the study 55% softwood and 45% hardwood chips were used. UF/Na-CMC modified glue with the ratios of 100/0%, 95/5, 90/10, 85/15, 80/20, 75/25, 70/30, 65/35, 60/40, 55/45, 50/50 were used to manufacture test boards. The physical and mechanical properties of the sample boards were determined to find out the effect of Na-CMC over the boards properties. According to the derived results it was determined that addition of Na-CMC within 5-20% ratio increased internal bonding strength between the range of 6-40%. The highest IB strength with the value of 0,63 N/mm2 was determined at 20% Na-CMC added boards. It was determined that bending strength and the modulus of elasticity (MOE) were decreased by increasing of the Na-CMC. While the modulus of elasticity value 2920 N/mm2 on the control board, it was found 1451 N/mm2 on the test boards produced with 50% Na-CMC. It was also found that using Na-CMC affected negatively over the swelling and water absorption values of the physical properties of sample boards.