The effect of glue recipe on the properties of molded particleboard production

The type of glue and coating material used together with wood raw material in the production of molded particleboard are important parameters affecting the product properties. In this study, it is aimed to optimize the rate of melamine in the melamine urea formaldehyde (MUF) glue used in the production of molded particleboard. For this purpose, the effect of changing the rate of melamine in the MUF glue on the board properties was determined. Solid wood chips and forest industry wastes, planer chips and sawdust are used as raw materials in the production of test samples. In MUF glue used as adhesive, melamine ratios have been changed to 14, 15, 16, 17, 18, 19, 20%. By determining some physical and technological properties of the test samples, the effect of the rate of melamine in the MUF glue used was determined. According to the results obtained, it was determined that as the rate of melamine in MUF glue increases, the bending and screw holding strength of the boards increases, and the hot and cold-water resistance improves. In the use of MUF with 20% melamine content in the lowest thickness, the swelling resistance was determined as 1.48% and cold-water resistance was 0.58%, the highest values of mechanical properties were 401.55 kgf / cm2 for bending strength and 18,16 kgf / cm2 for screw holding strength.