PMMA yapıştırıcılı pul bağlama yöntemiyle kapasitif mikroişlenmiş ultrasonik güç çevirici (CMUT) üretimi

Capacitive Micromachined Ultrasonic Transducers (CMUTs) are the potential alternatives for the conventional piezoelectric ultrasonic transducers. CMUTs have been under an extensive research and development since their first development in the mid-1990s. Initially developed for air-coupled applications, CMUTs have shown far better acceptability in immersion-based applications (i.e. medical ultrasonic imaging, medical therapy, and underwater imaging) when compared to the piezoelectric ultrasonic transducers. CMUTs are parallel-plate capacitors fabricated using the Micro Electro Mechanical Systems (MEMS) technology. Despite of the fact that various CMUT fabrication methods have been reported in the literature, there are still many challenges to address in CMUTs design and fabrication. Standard fabrication techniques are further sub-divided into the Sacrificial Layer Release Process and the Wafer Bonding methods. A number of complications are associated with these techniques, such as optimization of the design parameters, process complexity, sacrificial layer material with the corresponding etchant selection, wafer cost and selection. In particular, the sacrificial release methods consist of complex fabrication steps. Furthermore, structural parameters like gap height and radius have optimization issues during the sacrificial release process. On the other hand, the wafer bonding techniques for the CMUTs fabrication are simple and have a great control over the structure parameters in contrast to the sacrificial release methods. At the same time, the wafer-bonded CMUTs require very high quality wafer surface and have a very high contamination sensitivity. For this purpose, this dissertation aims to develop a simple, low cost and lower constraint thermocompression-based technique for the CMUT fabrication. The proposed wafer bonding technique for the CMUT fabrication in the dissertation uses Polymethyl methacrylate (PMMA) adhesive as an intermediate layer for the thermocompression wafer bonding. The advantages associated with the PMMA adhesive based wafer bonding over the other wafer bonding methods include low process temperature (usually 200 ◦C or less), high wafer surface defects and contamination tolerance, high surface energy and low bonding stresses. These factors will add cost effectiveness and simplicity to the CMUTs fabrication process. Furthermore, the achieved receive sensitivity with the reported CMUT is found comparable to the commercially available ultrasonic transducers.