Effect of chip temperature on board properties in gluing

In this study, the effect of chip temperature changes on the mechanical and physical properties of particle boards (PBs) was investigated. As raw materials were used 30% softwood, 35% hardwood (hornbeam, beech) and 35% poplar wood chips in particle board production. Urea formaldehyde (UF) resin was used as a binder in the production of single-layer PBs in the ratios of 10%. Mechanical and physical properties of test boards were determined. As a result, it was determined that the optimum chip temperature for board production is between 30 and 40 0C. Under these conditions, average bending strength, internal bond strength and the screw withdrawal strength parallel to surface were determined 15.14 N / mm2, 0.75 N/mm2 and 1011 respectively. According to experimental results, average internal bond strength was determined 0,57 N/mm² in 50 and 550C of chip temperature. This value (0,57) is 19% lower than boards made from 30 and 400C of chip temperature. It was show that increasing chip temperature has led to a decrease of strength values in gluing. For this reason, more glue will be required to achieve the same resistance values and so glue consumption will increase. On the other hand, it was observed that the change of chip temperature did not significant effect on the water absorption and bending resistance in the gluing.