Experimental investigation of the thermal performance of CPU heat sink coolled with AL203-water and SiC-SU nano fluid

Electronic components suffer from the main drawback of reduced lifetime/efficiency and an increase of thermal destruction because of unavoidable high temperatures. Therefore, to resolve these problems, employing efficient and reliable cooling methods is an important issue to control the temperature rise, collect the accumulated heat, and improve the performance of high-power electronic components. In this study, the cooling of an electronic central processing unit (CPU) with the aid of a nanofluid-based mini-channel heat sink was studied. Heat flux (6000, 7000, 8000 and 9000 W/m²), nanofluid mass fraction, (0.2% and 0.4%) and and coolant flow rate (60, 75, 85 and 105 ml/min) are variable analyzed as parameters. Several important parameters were investigated, such as CPU surface temperature, thermal resistance, and thermal efficiency. Experimental data are obtained at an applied heat flux of 9000 W/m² and a flow rate of 60 ml/min, with a maximum CPU temperature of 41.4°C. CPU surface temperatures for 0.2% SiC/pure water and 0.2% Al2O3/pure water; for 2 and 3 °C and 0.4% SiC/pure water and 0.4% Al2O3/pure water, respectively; 4 and 5°C decreased. In the case of fan and liquid cooling, the thermal efficiency of 0.2% SiC/pure water, 0.2% Al2O3/pure water, 0.4% SiC/pure water and 0.4% Al2O3/pure water refrigerant, respectively, according to the thermal efficiency of pure water; 20.7%, 35.5%, 42% and 48.1% increased. Average thermal resistance (Rth) values of 0.4% Al2O3/pure water decreased by 13.15%, 20.27%, 27.61% and 36.42%, respectively, with the increase of flow rate from 60 ml/min to 105 ml/min, according to the thermal resistance of pure water.