Numerical and experimental investigation of effects of porous layer on cooling of electronic components

In this thesis, heat transfer and fluid flow characteristics over an electronic component covered with a porous medium were investigated both experimentally and numerically. For these purposes, an experimental setup was developed and constructed, and a computer program was developed using the OpenFOAM platform. The electronic component considered was modelled by a heat dissipating block made from brass. The heat dissipating block was made in the same dimensions as a real graphic processing unit (GPU). The top surface of the block was covered by a porous layer made from aluminum. To study the heat transfer from the block under different flow conditions, it was placed in a rectangular channel. To compare the role of the porous layer on cooling of the electronic components, both experimental and numerical studies were also conducted for the block without porous layer. The problem was assumed to be three dimensional, turbulent and steady. In the experimental studies, the temperature distribution in the heat dissipating block was measured at different Reynolds numbers (20000