Investigation the using heated aggregate in chip seals on the effect of adhesion properties

Chip seals (CS) are one of the mostly used asphalt pavement type in Turkey because of the advantages of low cost, quickly construct and opened to traffic, high friction and smooth surface properties and etc. Chip seals which was constructed on unbound granular base's surface is widely used some countries such as Turkey, South Africa, Australia, New Zealand, England and etc. Especially in Turkey, 39333 km of 67333 km highway network is constructed by chip sealed road pavement. Chip seals are also widely used as a preventive maintanance application for bituminous hot mix pavements. Performance of chip seals on unbound granular base can be affected by number of factors before and after the construction different from bituminous hot mix pavements. The adhesion performance of the aggregate in chip seals is significantly influenced by factors such as traffic volume, location, nominal size of the applied aggregate, and construction method. In this thesis, the effect on adhesion performance in chip seals was investigated by Vialit adhesion and Nicholson stripping tests used three types of aggregates at four different temperatures (0 oC, 80 oC, 90 oC, 100 oC, 120 oC) and two different types of bitumen modified with Poly Phosphoric Acid (B50 / 70, B160 / 220) (PPA). The results of test showed that PPA addition and heating of the aggregates has a positive effect on the chip seal's adhesion performance.