Yarı iletkenler ve seramiklerin mikro-lazer destekli işlenmesi

The aim of this PhD dissertation is to determine the potential enhancement that micro (µ) Laser Assisted Machining (LAM) provides to the precision machining process for semiconductors and ceramics such as, Si and SiC, which are typically very hard and extremely brittle and therefore very difficult to machine by conventional methods. The µ-LAM system has been designed, built, tested and evaluated. Experiments were conducted on semiconductor and ceramic wafers to evaluate the effect and improvement to the machining process resulting from the laser heating and thermal softening. The underlying science and experimental hypothesis are that the laser is selectively heating the work piece material in contact with the cutting tool. This heating occurs in the deformation zone (chip formation and material removal) resulting in thermal softening of the work piece material and leading to reduced machining forces and improved tool life. It has been demonstrated by this novel µ-LAM technology that it is feasible to preferentially heat the high pressure metallic phase of Si and SiC during the material deformation process using laser heating. The thermal softening effect resulting from the localized heating enhances the ductility, and thus improves the material?s machinability.