Stress analysis of double pinned and adhesively bonded composite plates with different adhesive types

In this study, the effects of different adhesive types on stresses in a laminated composite plate with different orientation angles which double pin connection applied has been investigated. It is aimed to determine and compare the stresses occurring between the models in the whole model and hole regions as a result of the application of tensile load to the material. ANSYS (V19) finite element software was used for analysis, modeling and solution. Modeling was done in three dimensions. Necessary boundary conditions and loads have been applied on the model. Unlike the existing studies, contact analysis was performed for the hole and the pin on the layered composite plate and analysis was carried out in this way.