Thermal analysis of multi-chip and variable section electronic systems

In this study, the flow and heat transfer over the blocks simulating a multi-chip and variable cross-section electronic circuit board is analyzed computationally using the Ansys-Fluent program. The main objective of the thermal control of electronic elements is to keep the temperature of the element within the specified limits. Operating temperatures exceeding limits will result in decreased performance and logical errors. In order to prevent this undesired working environment from forming, electronic elements should be designed appropriately. The method of cooling based on forced transport and using fluid as a air was investigated. The speed and heat transfer characteristics in flat and different sections (rectangular, trapezoidal, triangular and semicircular) have been investigated depending on the flow rate of u1 = 0,03 m/s (Re 50) and u2 = 0,12 m/s (Re 200) and 30 °C, 40 °C and 60 °C temperature values. Stanton numbers obtained from the analyzes are used to compare geometric models in different sections. In geometric models; In parallel with the changes in the number of stantons, heat transfer was found to be the highest in the triangular chip model. In this way, when using triangular chips in the design of electronic systems, it is observed that errors and performance decreases that may occur at high operating temperatures compared to other geometric models are prevented.