Stability and reliability analysis of integrated optical devices

The aim of this study is to determine whether the integrated optical devices are suitable for the mass production by analyzing their integration, packaging, test and characterization processes. In accordance with the analyses, the fiber integration operations of more than 500 devices were carried out and the devices which were produced according to case D geometry were preferred in the production line. By taking as a reference of thermal tests, "successful/fail" classification of the devices were made. The stress variation in the epoxy regions was analyzed by carrying out thermomechanical simulations, so the verification of the experimental findings was aimed. It was confirmed that the stress accumulation induced on region 1 is an important stress mechanism and also it was appointed that this stress accumulation affects the device stability critically. The effect of the induced stress level through the waveguide core on the optical transmission was investigated. In the packaging studies, it was observed that the power fluctuation during repeatable thermal tests could be eliminated by the usage of type 1 application. After the packaging step, the electrical characterizations were carried out in the open-loop system. The reset signal peak was not encountered for the devices coated with the silicone based conformal coating. The temperature dependent half-wave voltage variation was measured around 560 ppm / °C during thermal tests between -40 °C and +85 °C temperature values and it was understood that this value is consistent with the results obtained from the literature researches. In the closed-loop system, performance stability tests based on the thermal aging operation were made. At the end of the test results of four different devices, almost 10 fold recovery in the slope of the earth rate was observed thanks to the repetitive thermal cycles. In the interferometer analyses, the polarization extinction ratio variation inside the device crystal, interference situations at different splice points and between fiber pigtail carrier/device interface were analyzed. In consequence of the evaluations, the polarization of the integrated optical device was measured 50 dB. Finally, in this thesis the analyses of the devices inside and outside the FOG sensor were practiced and so the devices which ensure the requirements in terms of a product were incorporated to the mass production process. The produced integrated optical devices were entitled as multi functional integrated optical chip. These devices are approved as principal milestone of tactic and navigation grade fiber optic gyroscope sensors which are used in military applications.