Thermal paste production with different viscosity regulator products and thermal performance analysis

The rapidly developing electronics sector in the world is damaged due to the excessive work of the operating systems of devices, machines or parts close to them or the high temperature of the environment in which they are located. In order for these parts to perform well, their working conditions must also be good. Thermal pastes with a wide range of uses are preferred for this. Thermal paste (also called thermal gel, thermal compound, heat paste, cooling paste, heat transfer compound, heat transfer paste or cooling compound) is a liquid substance with properties close to paste that increases thermal conductivity by filling the microscopic air gaps formed between the processors and the cooler due to their uneven and smooth surfaces. The most important factor affecting the thermal conductivity coefficients of these substances is that the binder products used affect the viscosity of the thermal paste in the mixture. In line with these goals, the aim of this study is to investigate the effect of viscosity on thermal conductivity and to produce optimum thermal paste using the most suitable binders.