Preparing of enhanced thermal conductivity properties of polyamide 6,6 composites

PREPARING OF ENHANCED THERMAL CONDUCTIVITY PROPERTIES OF POLYAMIDE 6,6 COMPOSITES ABSTRACT Polyamide 6,6 (PA 6,6), which is in the class of engineering plastics, is a polymer with high strength, good electrical and chemical properties. PA 6,6 is widely used industrially. PA 6,6 has different application areas such as seat belts, electrical control buttons, fuse boxes, cable tie buckles, gears, camshafts and various automotive parts. Products manufactured from PA 6,6 affect product geometry and reduce mechanical properties when exposed to heat during use. The thermal deformations of PA 6,6 can be prevented by adding reinforcing materials with high thermal conductivity coefficient. The thermal conductivity of PA 6,6 with low thermal conductivity is improved by the addition of conductive filling materials. In this study, it is aimed to improved the thermal conductivity properties of polyamid 6,6 with the addition of copper powder, carbon black and carbon fiber. The effect of copper powder, carbon fiber and carbon black on the thermal properties and mechanical properties of PA 6,6 was investigated. The thermal conductivity, mechanical tests and microstructure studies of the samples prepared in different ratios were performed. The addition of carbon fibers improved thermal conductivity and mechanical properties. When carbon black and copper powder to PA 66 are added, the mechanical properties of PA 6.6 decrease and thermal conductivity is improved. The highest thermal conductivity was measured as 0.73 W / mK for the PA 6.6 sample containing 10 percent by volume carbon fiber, copper powder, carbon black. In this study, it is aimed to improve the thermal conductivity properties of PA 6,6 by using conductive fillings. Keywords: Thermal conductivity, polyamide 6,6, carbon fiber, carbon black, copper powder, composite.