Malzeme ve geometrik parametrelerin soğutucu ısı verimi üzerine etkisinin sayısal analizi

The challenge for designers is to try to make electronic boards smaller. From this point of view, in this study, the size of a heat sink installed on a central processing unit for a computer that generates 100 W was reduced to 50 % by changing the type of metal as well as adding a modification to the geometric shape of the fin. A numerical investigation was conducted for the results of a practical experiment. Six different types of heat sinks, differing from each other in terms of fin shape, were designed using commercial design software, taking into consideration the uncomplicated design, ease of manufacture, and cost avoidance. The material of the heat sink was copper, all designs were of the same sizes, the comparison was conducted to evaluate the efficiency fairly. After the computational fluid dynamics simulation tool was set under forced convection conditions, and the cooling airflow velocity was set in a laminar form, which was set to 1 m/s. The comparison was based on the pressure difference as well as the thermal resistance, it was shown that separated short angled plate fins were superior to the rest designs as it had the lowest thermal resistance 0.3610 ℃/W, but on the other hand, recorded the highest-pressure difference which was 5.6340 Pa, thus was the worst for the pressure difference. The results showed that the intermittent zigzag fins were superior in terms of pressure difference, which had the lowest value of 3.2040 Pa, but on the other hand, it was the worst in terms of thermal resistance, as it recorded the highest value 0.4720 ℃/W. Through all of the above, it can be concluded that the process of reducing the size of the heat sink to 50% was completed by changing the type of material as well as making some modifications to the design of the fin, and in addition to that, the geometric shape of the fin affects the performance of the heat sink where it was evident in each of the pressure difference as well as of thermal resistance factors.