Sayısal ve deneysel analiz kullanılarak bir bilgisayar için daldırma soğutma sisteminin çalışması ve tasarımı

Computer systems may be able to use electricity more effectively if cooling electronics systems is done more properly. Computer and some other electronic device could be cooled via immersion-cooling by immersing them in a thermally conductive liquid or coolant. In this study, a unique forced flow and heat sinks cooling system and technique for a single-phase immersed cooling system are presented. The CPU surface is covered with a straight fin heat-sink, and whole mainboard is immersed in 3M Novec 7100, a designed fluid that can disperse heat is utilised while utilizing immersed cooling. A simulation model created utilizing the ANSYS Multiphysics programme is validated by an experimental test. To investigate consequences of a single-phase immersed cooling system's cooling, three liquid coolant circulating speeds and two distinct heat sink material are utilized. utilizing a cross-sectional view and then a 3D isothermal surface model, the heat the model's chosen distribution was examined with different liquid coolants and material flow rates. The simulation results demonstrate that a cooler CPU would operate at a lower temperature if the liquid coolant moved more quickly. However, because of the slower circulation speed, the coolant flow was impeded. Additionally, it contributed to the uneven distribution of heat and higher temperature levels. The greatest temperature was recorded, and it was found that the model's imbalanced heat transmission. It should be noted that results are not considerably impacted by the heat sink's material. The system designer can utilize the results to boost power densify and ensure the secure operation of an associated computer and electronic devices.