Production of copper based shape memory alloy by thermal evoporation method

In this study, Cu-Al-Ni shape memory alloy produced by the method of thermal evaporation. Initially in this experimental process, determined Cu-Al-Ni shape memory alloy was obtained using electroslag remelting method. Then, the obtained alloy ingots was cut to small pieces, and coated on the silisium as a thin film with thermal evaporation method. After this experimental method, thermal and structural characteristics of the alloy and thin film obtained by thermal evaporation process were analyzed. EDX analysis, X-ray diffraction, metallographic methods, differential scanning calorimetry (DSC) and differential thermal analysis (DTA) of the alloy and thin film was used in this analysis. At the end of the observations, the reflection planes of both Cu-Al-Ni alloy and the thin film obtained by the method of thermal evaporation of this alloy determined by X-ray measurements. The owned structures of the alloy and thin film were examined by metallographic analysis and SEM observations. The start and finish temperatures of characteristic austenitic and martensitic phase of the alloy and thin film was determined. As a result of differential thermal analysis measurements, in high-temperature and low-temperature region regular and irregular phase transitions were determined in the structure of the alloy and the thin film. Obtained data were evaluated at the end of the experimental process. Accordingly, for the purpose of this thesis, Cu-based Cu-Al-Ni shape memory alloy was obtained by the method of thermal evaporation. The martensitic structures were observed in the alloy, but these observations could not be observed in thin film. While austenitic, martensitic phase transition could be observed in the resulting alloy, only martensite ? austenit transition observed in thin film. This is because very small amount of the material was coated on the Si substrate in the thin film by thermal evaporation method. Although the eutectoid point determined in TG / DTA measurement of the alloy, this analysis could not be made for thin film.