Uzay uygulaması için nanoyapı ilaveli ısı transfer alanı artırılmış mikrokanallı buharlaştırıcı

Increasing processing capacity within the size of electronic device has made thermal management a key factor to electronic industries. Commercialized thermal management such as conventional air cooling system will not suffice the future requirements due to effects of increasing heat dissipation and miniaturization. In order to increase performance of electronic devices with high heat flux needs to be dissipated and electronic devices must operate reliably within safe temperature ranges. Heat transfer improvement will result in lower size of equipment and increased efficency. Compared to other conventional methods of heat transfer, pool boiling offers a much attractive option, as it is able to dissipate large amount of heat at low wall superheats. Evaporators play a crucial role in the design of vapor chambers and heat pipes. Reducing the temperature difference during evaporation and increasing heat flux are two important areas that directly affect the performance of the heat transfer systems. Therefore, special surfaces have been developed to further enhance the heat transfer using pool boiling. These special surfaces are microchannel, sintered and pin-fins. The present study deals with enhancement of heat transfer using combination of multiple passive techniques, namely nanostructures and microporous sintered surfaces over open microchannel surfaces and microchannels with pin-fins. Seven structures were studied as individual. Experiments were conducted to study the effects of microchannel, sintered, and pin fins ( micropillar) on the boiling heat transfer from a copper chip in a pool of degassed water. Boiling performance was measured in terms of critical heat flux (CHF) and heat transfer coefficient (HTC). Both HTC and CHF have been greatly improved on all modified surfaces compared to the plain copper chip baseline.