The effect of using mold release agent in particleboard production on the technological properties of the board

This study investigates the influence of mold release agent, widely utilized in panel production, on the physical and mechanical properties of particleboard by introducing varying quantities into the production process. To this end, tests were carried out and analyzed by adding mold release agent to the top and bottom layers of the particleboard production with a thickness of 18 mm and a density of 630 kg/m³ in amounts ranging from 0 to 25 g/m² in increments of 5. Subsequent to this, the outcomes were examined. Laboratory analyses were executed in compliance with the TS EN standards at Kastamonu Entegre Inc.'s Gebze Particleboard Factory Laboratory. Physical properties of the board, including density, moisture content, swelling, water absorption, and surface absorption, were tested, while changes in mechanical properties such as bending strength, modulus of elasticity, surface perpendicular tensile strength, screw holding strength, and surface durability were examined . Furthermore, the influence of chemical amount, as a production parameter, on the press production speed has also been evaluated. As a result of analysis, a significant interaction between the chemical addition of the mold release agent and the surface absorption value, bending strength and bending modulus of elasticity values was observed. Additionally, it was noted that while enhancing the ability to accelerate production, it also contributes to capacity expansion and minimizes potential adhesion on the production line, hence positively affecting the quality of the panel.