Investigation of the thermal, electrical and mechanical properties of low Ag content, Sn–Ag–Zn lead-free solders

Sn-2 wt. % Ag-2 wt. % Zn, Sn-2 wt. % Ag-2.5 wt. % Zn, Sn-1.5 wt. % Ag-2 wt. % Zn, Sn-1.5 wt. % Ag- 2.5 wt. % Zn the change in thermal conductivity of lead-free solder alloys with temperature was measured by the linear heat flow method, and the change in electrical conductivity depending on temperature was measured by the 4-point conductivity measurement technique. Graphs of the changes in electrical and thermal conductivity of the alloys depending on temperature were also drawn. With the help of these graphs, thermal and electrical conductivity coefficients were determined. Microhardness and tensile-strain tests were performed to determine its mechanical properties. In the thesis study, microhardness measurements were made using the Vickers hardness measurement method. Tensile analysis was performed by pulling on a mechanically driven tensile device in a single axis and at a constant speed until it was broken. Force-extension curves were drawn for each sample. Keywords: Lead-Free Solder Alloys, Thermal Conductivity, Electrical Conductivity, Mechanical Properties