Elektrokimyasal kaplama yöntemi ile Au-Ag-Cu üçlü alaşımlarının oluşturulması

Gold-Silver-Copper alloys have high electrical conductivity and high corrosion and wear resistance. They are mostly used in slip rings, which are the significant part of electromechanical systems having ability to rotate 360° such as air, naval and land defense systems, medical devices like magnetic resonance imaging or computed tomography. In the scope of the study, static potential and cyclic voltammetry measurements were done to determine the optimum potassium cyanide amount and reduction potential for gold, silver and copper metal ions from unary, binary and ternary mixtures of potassium gold cyanide, silver cyanide and copper cyanide plating baths. The effects of different potassium cyanide, potassium gold cyanide, silver cyanide and copper cyanide concentrations and reduction potentials on the deposited alloy composition were studied. Analyses by scanning electron microscopy, energy dispersive spectroscopy and x-ray fluorescence characterization devices were carried out to obtain information on surface morphology, coating thicknesses and alloy compositions from the top and cross section of samples. Moreover, hardness tests of samples having different alloy compositions were done and results were compared with electroplated pure Au. Finally, scratch test via nano-indentation device was done to observe the bonding strength between gold-silver-copper alloy and nickel coating layers.