Thermal analysis of PCB boards used in automotive lighting systems

Within the scope of this thesis, computational thermal analysis and verification tests of these analyzes were carried out for the heat transfer problems caused by the replacement of halogen bulbs, which are used extensively in the lighting industry, by developing LED components. Thermal problems caused by high temperatures encountered in LED lighting systems have been identified by investigating general information about other electronic components and PCB boards required for the use of LED components. The effects of these thermal problems on lighting have been studied. The constraints created by the thermal problems on the cards on the products were defined and software supported thermal analyzes were made according to these constraints. Analysis results are interpreted to give feedback to the design studies. Thermal cycle tests were carried out in the laboratory in order to verify the thermal analysis results. The tests were carried out in thermal cabinets simulating the 25°C environmental conditions determined in the analysis environment. During the tests, in order to determine the temperature differences on the card, the temperature measurements were made on the card under 50mA current and compared with the analysis. Then, the temperature values measured on the card under 12V and 24V voltage were observed to see the effect of the voltage on the card. These observations were interpreted by comparing them with the analysis results. When the test results and analysis results were compared, it was revealed that the theoretical studies were consistent with the temperature measurements occurred on the product. Although the differences between the analysis results and the test results differ for each function, it was observed that the average was below %5 and the analyzes were confirmed by %95.