Investigation of the effect of Zn addition on mechanical and thermal properties of Sn-10Bi-0.8Cu and Sn-10Bi-5Sb alloys

Sn-10ağ.%Bi-0.8ağ.%Cu, Sn-10ağ.%Bi-0.8ağ.%Cu-1ağ.%Zn, Sn-10ağ.%Bi-5ağ.%Sb, Sn-10ağ.%Bi-5ağ.%Sb-1ağ.%Zn the change in thermal conductivity of lead-free solder alloys with temperature was measured by the linear heat flow method. Graphs of the changes in thermal conductivity of the alloys depending on temperature were also drawn. With the help of these graphs, thermal conductivity coefficients were determined. Microhardness and tensile-strain tests were performed to determine its mechanical properties. In the thesis study, microhardness measurements were made using the Vickers hardness measurement method. Tensile analysis was performed by pulling on a mechanically driven tensile device in a single axis and at a constant speed until it was broken. Force-extension curves were drawn for each sample. SEM, EDX and XRD methods were used in the microstructure analysis of the alloys.